In-Situ Observation and Analysis of the Evolution of Copper Aluminum Composite Interface

To study the micromorphology and dynamic evolution law of copper aluminum composite interface evolution, ultra-high temperature laser Confocal microscopy (CLSM) was used to observe analyze in situ, then SEM, EDS other advanced material analysis methods were layer, composition layer formation process interface. The results indicate that is mainly related mutual diffusion atoms reaction between aluminum. bonding melting metal surface atoms, which main mechanism bonding. intermetallic compound Al2Cu. In observation shows there a clear relatively flat boundary while not straight, caused by difference thermal expansion coefficient, Lattice constant hardness compounds matrix compounds. At same time, it found certain relationship visual changes image reaction-diffusion migration during in-situ using confocal scanning high-temperature microscope. Moreover, under no pressure, oxide inclusions can seriously affect